发明名称 LAMINATED STRUCTURE AND ITS MANUFACTURING METHOD, MULTILAYER WIRING BOARD, ACTIVE MATRIX SUBSTRATE AND IMAGE DISPLAY DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated structure allowing high-throughput manufacturing of a laminated structure having a fine conductive layer, even in the case of using an ink jet method, as well as to provide a laminated structure, a multilayer wiring board, an active matrix substrate, and an image display device. <P>SOLUTION: High surface energy parts 40 of the same pattern are arranged periodically at fixed intervals on a substrate, and an interval between discharge nozzle 1 and 2, along a main scanning direction ( x-axis direction ) of an inkjet device, is then made to coincide with the pattern interval of the high surface energy parts 40 so that functional liquid droplets d are dropped selectively to form a conductive layer which is to be a source electrodes 230, source electrode lines 290, and drain electrodes 240. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011228476(A) 申请公布日期 2011.11.10
申请号 JP20100096874 申请日期 2010.04.20
申请人 RICOH CO LTD 发明人 ONODERA ATSUSHI;SUZUKI KOEI
分类号 H01L21/288;B05D1/26;G02F1/1343;G02F1/1345;G02F1/1368;H01L21/3205;H01L21/336;H01L29/786;H05K3/10 主分类号 H01L21/288
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