发明名称 PICK AND BOND METHOD AND APPARATUS FOR TRANSFERRING ADHESIVE ELEMENT TO SUBSTRATE
摘要 A method and apparatus for transferring formed adhesive elements from a reservoir containing plural formed adhesive elements to a bonding part attachable to a glass surface or other substrate through the use of adhesives. Transfer of the formed adhesive element to the bonding part is accomplished by use of a vacuum tool having a vacuum outlet, an internal plenum, and a series of vacuum lines formed in an adhesive element holding face. The vacuum tool is positioned over a reservoir of formed adhesive elements. The reservoir may have multiple layers of formed adhesive elements or may have a single layer. If the reservoir has plural layers it may be fitted with a plenum and air lines to help lift the formed adhesive elements to move them into contact with the adhesive element attachment face of the vacuum tool. Once the formed adhesive elements have been captured by the vacuum tool the tool is used to place them into contact with the heated bonding part directly or indirectly by intermediate placement onto a matrix having a plurality of ejector pins movably fitted therein. The ejector pins move the formed adhesive elements into position against the bonding part.
申请公布号 WO2011138684(A2) 申请公布日期 2011.11.10
申请号 WO2011IB01423 申请日期 2011.05.03
申请人 A. RAYMOND ET CIE;HANSEL, MATHIAS 发明人 HANSEL, MATHIAS
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