System for dispensing soft solder for mounting semiconductor chips using multiple solder wires

摘要

An apparatus (10) for dispensing solder onto a substrate (12) for mounting a semiconductor chip on the substrate comprises a dispensing body (18) and first and second dispensing channels extending through the dispensing body. Each dispensing channel is operative to receive a separate solder wire to feed the solder wire (24) to an end of the dispensing body facing the substrate. The dispensing channels are further operative to introduce the solder wires in a solid state simultaneously from the end of the dispensing body to be melted upon contact with the substrate which is heated.