发明名称 |
SUBSEQUENTLY CURABLE RESIN COMPOSITION FOR LEAD LOCK TAPE AT HIGH TEMPERATURE AND LEAD LOCK TAPE USING THE SAME |
摘要 |
PURPOSE: A resin composition for a lead lock tape is provided to prevent the shift of a lead, to enhance crosslinking density of a lead lock tape adhesive component, and to ensure excellent thermal resistance and physical strength. CONSTITUTION: A resin composition for a lead lock tape which is subsequently curable at high temperature comprises 100 parts by weight of an epoxy resin, 1~50 parts by weight of a low temperature hardening material, 10~80 parts by weight of a high temperature hardening material, and 20~150 parts by weight of a thermoplastic resin for modification. The low temperature hardening material is primary amine. The high temperature hardening material is a phenol-based hardening agent or anhydride-based hardening agent.
|
申请公布号 |
KR20110121882(A) |
申请公布日期 |
2011.11.09 |
申请号 |
KR20100041381 |
申请日期 |
2010.05.03 |
申请人 |
TORAY ADVANCED MATERIALS KOREA INC. |
发明人 |
HONG, SEUNG WOO;KIM, WOO SEOK;MOON, KI JEONG;KIM, SANG PIL |
分类号 |
C08L63/00;C08K5/105;C08K5/17;H01L23/48 |
主分类号 |
C08L63/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|