| 摘要 |
A substrate stage mechanism (10) configured to place a substrate (W) thereon inside a process container of a substrate processing apparatus (100) and having a substrate heating function for heating the substrate (W) includes a substrate table (11) including a base body (11a) configured to place the substrate (W) thereon and a heating element (13) provided to the base body (11a) and configured to heat the substrate (W); a support member (12) having an upper end connected to the substrate table (11) and a lower end attached to the process container; and a heating device (17) configured to heat the support member (12).
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