发明名称 Method for manufacturing light-emitting device and manufacturing apparatus of light-emitting device
摘要 An object is to provide a method for manufacturing a light-emitting device in which a defective portion is insulated. In addition, another object is to provide a manufacturing apparatus of a light-emitting device in which a defective portion is insulated. After a hemispherical lens is formed to overlap with a light-emitting element, the defective portion is detected. Then, the hemispherical lens overlapping with the light-emitting element including the detected defective portion may be irradiated with a laser beam having a low energy density, and the defective portion may be insulated by light condensed through the hemispherical lens.
申请公布号 US8652859(B2) 申请公布日期 2014.02.18
申请号 US201213357900 申请日期 2012.01.25
申请人 TANAKA KOICHIRO;SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 TANAKA KOICHIRO
分类号 H01L21/66;G01R31/26 主分类号 H01L21/66
代理机构 代理人
主权项
地址