发明名称 SOLID-STATE IMAGING ELEMENT AND ELECTRONIC INFORMATION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To obtain an image data of high picture quality which is made smaller in pixel size and free of color mixing and crosstalk, without complicating a manufacturing process, while a latchup is prevented from occurring in a peripheral circuit region. <P>SOLUTION: The element is provided with a p-type semiconductor substrate 1, a p-type well layer 3 formed above the substrate, an n-type photoelectric conversion layer formed within a p-type well layer 3 as a light receiving portion 4, and a floating n-type accumulation layer 2 between the p-type semiconductor substrate and the p-type well layer 3. This floating n-type accumulation layer 2 is formed all over the pixel area including a light-shielding pixel area OB, but not on a CMOS circuit portion side on the periphery of the pixel area. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011222876(A) 申请公布日期 2011.11.04
申请号 JP20100092678 申请日期 2010.04.13
申请人 SHARP CORP 发明人 KOYAMA HIDETSUGU
分类号 H01L27/146;H04N5/374 主分类号 H01L27/146
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