LEADFRAME, WIRING BOARD, LIGHT EMITTING UNIT, AND ILLUMINATING APPARATUS

摘要

Disclosed is a leadframe wherein a wiring pattern supported inside of a one-pitch outer frame section with a supporting piece therebetween is provided with a plurality of base units, each of which is provided with: a die pad that has a solid-state light emitting element mounted thereon; a heat sink that extends from the die pad so as to surround the die pad; and a lead, which is electrically connected to one electrode of the solid-state light emitting element, which has the other electrode electrically connected to the heat sink. The lead of one of the adjacent base units and the heat sink of the other base unit are connected and are electrically connected in series. Using the leadframe, an increase of the temperature of the solid-state light emitting element can be suppressed, light output of the solid-state light emitting element is increased, and the cost of a light emitting unit used by connecting the solid-state light emitting elements in series can be reduced. Also disclosed are a wiring board, the light emitting unit, and an illuminating apparatus.