| 摘要 |
An integrated circuit package structure includes an integrated circuit (IC) module, a plastic encapsulation, and input/output pins. The IC includes a substrate configured with signal lines and input/output ports disposed at edges of the substrate, chips, and wires. The chips are mounted on surfaces of the substrate, and the wires connect the chips to the signals lines and the input/output ports. The plastic encapsulation encapsulates the IC module to form an encapsulation body including an upper surface, a lower surface, and side surfaces, and the input/output ports are exposed out of the encapsulation body. The input/output pins are disposed on the side surfaces and at least one of the upper surface and the lower surface of the encapsulation body, and correspondingly leads the input/output ports to the at least one of the upper surface and the lower surface of the encapsulation body.
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