发明名称 |
WIRE BOND INTERCONNECTION AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of a semiconductor package includes: providing a substrate; mounting a semiconductor die on the substrate, the semiconductor die having a die pad; mounting a lead finger on the substrate; attaching a support pedestal on sides of the lead finger; and attaching a wire interconnection between the die pad and the support pedestal, the wire interconnection having a ball bond on the die pad and a stitch bond on the support pedestal.
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申请公布号 |
US2011266700(A1) |
申请公布日期 |
2011.11.03 |
申请号 |
US201113178331 |
申请日期 |
2011.07.07 |
申请人 |
LEE HUN-TEAK;KIM JONG-KOOK;KIM CHUL-SIK;JANG KI-YOUN;PENDSE RAJENDRA D |
发明人 |
LEE HUN-TEAK;KIM JONG-KOOK;KIM CHUL-SIK;JANG KI-YOUN;PENDSE RAJENDRA D. |
分类号 |
H01L23/498;H01L21/50 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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