发明名称 MIXED ALLOY SOLDER PASTE
摘要 A solder paste comprises an amount of a first solder alloy powder between about 60 wt % to about 92 wt %; an amount of a second solder alloy powder greater than 0 wt % and less than about 12 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above about 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than about 250° C.
申请公布号 US2011268985(A1) 申请公布日期 2011.11.03
申请号 US20100772897 申请日期 2010.05.03
申请人 发明人 ZHANG HONGWEN;LEE NING-CHENG
分类号 B32B15/01;B23K1/20;B23K35/34 主分类号 B32B15/01
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