GLASS CERAMIC FOR LED PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: Glass ceramic for a light emitting diode package and a method for manufacturing the same are provided to prevent the generation of solder cracks due to reduced thermal expansion coefficiency and to reduce the cost required for operational processes by reducing sintering temperature. CONSTITUTION: Glass ceramic is represented by formula xCaMgSi_2O_6·(1-x)MgSiO_3. The glass ceramic is sintered at a sintering temperature between 800 and 850 degrees Celsius, and the porosity of the glass ceramic is 1.5% or less. In the formula, the x is between 0 and 1 and is a rational number. The thermal conductivity of the glass ceramic is between 1 and 4 W/m degrees Celsius. A method for manufacturing the glass ceramic includes the following: A starting material is wet-mixed and molten. An annealing process is implemented to obtain primary glass, and the primary glass is pulverized. The pulverized primary glass is wet-mixed and molten. Another annealing process, pulverizing process, and drying process are implemented. Powder is obtained and is introduced into a mold. A molded product is maintained at a crystal nucleus forming temperature between 700 and 800 degrees Celsius for 2-3 hours. The crystal nucleus is sintered at a temperature between 800 and 950 degrees Celsius for 1 to 5 hours.