发明名称 Film depositing apparatus, a film depositing method, a piezoelectric film, and a liquid ejecting apparatus
摘要 A film depositing apparatus comprises: a process chamber; a target holder provided in the process chamber for holding a target; a substrate holder for supporting a deposition substrate such that the deposition substrate faces the target holder in the process chamber; a power supply for supplying electric power between the target holder and the substrate holder to generate plasma in the process chamber; and an anode provided between the target holder and the substrate holder for capturing ions and/or electrons in the plasma being generated within the process chamber, wherein the anode includes: a cylindrical member provided so as to surround an outer periphery of a side of the substrate holder that faces the target holder; and at least one annular plate member attached to an inside wall of the cylindrical member, the plate member having a central opening larger than a surface of the deposition substrate.
申请公布号 US8047636(B2) 申请公布日期 2011.11.01
申请号 US20090461463 申请日期 2009.08.12
申请人 FUJIFILM CORPORATION 发明人 FUJII TAKAMICHI;NAONO TAKAYUKI
分类号 B41J2/045;C23C14/00 主分类号 B41J2/045
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