发明名称 |
Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities |
摘要 |
A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. A housing at least in part encloses the semiconductor die and the interlayer material. The housing has a recess disposed through the second attachment surface of the electrically conductive attachment region. A dielectric, thermally conductive interlayer material is located in the recess and secured to the housing. A metallic plate is located in the recess and secured to the interlayer material.
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申请公布号 |
US8048714(B2) |
申请公布日期 |
2011.11.01 |
申请号 |
US20070827042 |
申请日期 |
2007.07.09 |
申请人 |
VISHAY GENERAL SEMICONDUCTOR LLC |
发明人 |
CHOU TA-TE;ZHANG XIONG-JIE;LI XIAN;FU HAI;TIAN YONG-QI |
分类号 |
H01L23/34;H01L21/00 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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