EPOXY RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD

摘要

Disclosed is an epoxy resin composition which possesses flame retardant properties without the addition of a halogen fire retardant agent to same, is heat-resistant to lead-free solder, and also provides a base material with excellent adhesion properties for plating. Further disclosed are a prepreg obtained from the composition, and a metal-clad laminate and printed wiring board with an insulating resin layer of the composition formed thereupon. The epoxy resin composition employed comprises: (A) a polymerised compound comprised of a phosphaphenanthrene group and at least one constituent chosen from a phenolic novolak polymer, and a phenolic novolak polymer with a hydrogen atom of a phenolic hydroxyl group substituted by a phosphaphenanthrene group; (B) an epoxy resin with two or more epoxy groups in one molecule; and (C) a hardening agent which hardens the epoxy resin.