| 摘要 |
A semiconductor device includes a supporting board having a protection film thereon; a semiconductor chip provided on the supporting board; a first internal connecting terminal formed on the supporting board; a second internal connecting terminal formed on the semiconductor chip; a first insulation layer for covering an upper surface of the supporting board and upper and lateral surfaces of the semiconductor chip; a wiring pattern provided on the first insulation layer, the wiring pattern connecting the first and second internal connecting terminals; a solder resist layer provided on the first insulation layer and the wiring pattern, the solder resist layer having an opening part; an external connecting terminal provided so as to connect to the wiring pattern through the opening part; a groove part formed on outer peripheries of the supporting board, the protection film, and the first insulation layer; and a resin layer formed in the groove part.
|
