| 摘要 |
PROBLEM TO BE SOLVED: To provide a means of correcting a warp of a ceramic substrate without dividing the ceramic substrate even when a plurality of metal circuit boards are formed on the ceramic substrate.SOLUTION: A metal ceramic joined body 1 formed by joining a metal plate, having a plurality of projections formed, to the ceramic substrate by bringing molten metal M into contact with at least one surface of the ceramic substrate, and then cooling and solidifying it, is clamped between a punch 21 having predetermined curvature R and a die 20 to be pressed. The metal ceramic joined body is subjected thereafter to etching processing to form a predetermined circuit pattern at each projection of the metal ceramic joined body, and parts other than the projections are removed. |
