发明名称 LOW FORMALDEHYDE EMISSION ADHESIVE SYSTEM
摘要 <p>The invention relates to an improved two component adhesive system, a kit comprising said two adhesive components, its use and a method for production of interior wood products, in particular form-pressed products, parquet floor elements and solid wood panels with very low formaldehyde emission and to the interior wood products obtainable having improved properties. The two-component adhesive system comprises adhesive component I comprising a 50-70 wt % melamine-formaldehyde (MF) type resin in 25-40 wt % water and adhesive component II comprising 25-40 wt % of a water based dispersion adhesive, 15-40 wt % of a formaldehyde scavenger and an acidic compound in an amount such that the pH of adhesive component II is 1.5-6.5, wherein adhesive component I and II are to be applied in a weight ratio I:II of 1:0.5 to 1:1.5 and the adhesive system has a molar ratio of formaldehyde (F) to total amino group (F/NH2) between 0.2 and 0.7.</p>
申请公布号 EP2265684(B1) 申请公布日期 2011.10.26
申请号 EP20090747798 申请日期 2009.08.12
申请人 DYNEA OY 发明人 PEDERSEN, ASTRID;GROSTAD, KRISTIN;SANDBAKKEN, PER
分类号 C09J161/28;C09J161/32 主分类号 C09J161/28
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