发明名称 Positive photosensitive composition, pattern forming method using the composition and resin for use in the composition
摘要 A positive photosensitive composition ensuring wide exposure latitude and reduced line edge roughness not only in normal exposure (dry exposure) but also in immersion exposure, a pattern forming method using the positive photosensitive composition, and a novel resin contained in the positive photosensitive composition are provided, which are a positive photosensitive composition comprising (A) a resin having a specific lactone structure in the side chain and being capable of increasing the solubility in an alkali developer by the action of an acid and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, a pattern forming method using the positive photosensitive composition, and a novel resin contained in the positive photosensitive composition.
申请公布号 US8043791(B2) 申请公布日期 2011.10.25
申请号 US20080678023 申请日期 2008.09.11
申请人 FUJIFILM CORPORATION 发明人 TADA YUKO;SHIMADA KAZUTO;HIRANO SHUJI
分类号 G03F7/039;C07D313/00;C08F224/00;G03F7/20;G03F7/30 主分类号 G03F7/039
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