CIRCUIT CONNECTING ADHESION FILM AND CIRCUIT CONNECTING STRUCTURE

摘要

Provided is a circuit connecting adhesion film having at least an adhesive layer (A) and an adhesive layer (B), wherein the adhesive layer (A) is an anisotropic conductive layer (11) containing a prescribed adhesive ingredient (3a) and conductive particles (5), and the adhesive layer (B) is an insulation layer (12) containing a prescribed adhesive ingredient (3b). The thickness of the adhesive layer (A) is 0.3 to 1.5 times the average particle diameter of the conductive particles contained in the adhesive layer (A), and the circuit pitch of at least one of two circuit boards is 40 µm or less.