ADJUSTING SUBSTRATE TEMPERATURE TO IMPROVE CD UNIFORMITY
摘要
Abstract A plasma etching system having a substrate support assembly with multiple independently controllable heater zones. The plasma etching system is configured to control etching temperature of predetermined locations so that pre-etch and/or post-etch non-uniformity of critical device parameters can be compensated for.
申请公布号
WO2011081645(A3)
申请公布日期
2011.10.20
申请号
WO2010US03149
申请日期
2010.12.13
申请人
LAM RESEARCH CORPORATION;GAFF, KEITH WILLIAM;SINGH, HARMEET;COMENDANT, KEITH;VAHEDI, VAHID
发明人
GAFF, KEITH WILLIAM;SINGH, HARMEET;COMENDANT, KEITH;VAHEDI, VAHID