发明名称 PHENOLIC RESIN MOLDING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a phenolic resin molding material capable of obtaining a molded article having an excellent deflection amount guessed as a characteristic contributing to prevention of a crack of an electric and electronic component and excellent electric characteristics.SOLUTION: The phenolic resin molding material includes a reaction product of a resol type phenol resin and a diamine compound. The content of the reaction product is preferably 20 to 75 wt.% to the whole molding material. The molding material further preferably includes a filler and the filler content is preferably 20 to 75 wt.% to the whole molding material.
申请公布号 JP2011202056(A) 申请公布日期 2011.10.13
申请号 JP20100071449 申请日期 2010.03.26
申请人 SUMITOMO BAKELITE CO LTD 发明人 TANAHASHI KOICHI
分类号 C08G8/28;C08L61/10 主分类号 C08G8/28
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