发明名称 |
SOLDER RESIST COMPOSITION AND PRINTED CIRCUIT BOARD |
摘要 |
<p>Disclosed is a solder resist composition with high reflectivity and high resolution that includes (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) melamine or a derivative thereof, (D) a photopolymerizable monomer, (E) rutile titanium dioxide, (F) an epoxy compound, and (G) an organic solvent, and that prevents decreases in reflectivity that are attributable to discoloration and deterioration. Also disclosed is a printed circuit board obtained by forming a solder resist using the solder resist composition.</p> |
申请公布号 |
WO2011125820(A1) |
申请公布日期 |
2011.10.13 |
申请号 |
WO2011JP58178 |
申请日期 |
2011.03.31 |
申请人 |
TAIYO HOLDINGS CO., LTD.;YODA, AIKO;NOSAKA, MAMI;SHIMAMIYA, AYUMU;USHIKI, SHIGERU |
发明人 |
YODA, AIKO;NOSAKA, MAMI;SHIMAMIYA, AYUMU;USHIKI, SHIGERU |
分类号 |
G03F7/038;G03F7/004;G03F7/029;G03F7/031;H05K3/28 |
主分类号 |
G03F7/038 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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