COMPONENT ASSEMBLY

摘要

Provided is a component assembly that can be precisely and easily installed in a main board. The glass transition temperature of a component layer in a component assembly (10) in which a plurality of capacitors (52) are arranged is higher than the glass transition temperature of a component layer (5) of a component board (1), and therefore thermal deformation of the component assembly (10) can be suppressed even if the component board (1) in which the component assembly (10) is installed is heated by a reflow, for example, so the component assembly (10) can be precisely installed in the component board (1). In addition, when the component assembly (10) in which the plurality of capacitors (52) are embedded is installed in the component board (1), electrode pads (11) of the component assembly (10) can be electrically connected to wiring layers (4, 6) of the component board (1) by soldering regardless of height variations of the plurality of capacitors (52). The component assembly (10) can therefore be easily installed in the component board (1).