| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection device capable of performing more accurately defect inspection in the periphery of the end of a substrate, by performing irradiation with illumination light from a direction in which an effect of scattered light from a circuit pattern is suppressed.SOLUTION: The device includes an illumination unit 30 capable of irradiating the periphery of the end of a wafer 10 having a circuit pattern formed on the surface with illumination light from a plurality of directions, an imaging unit 40 for detecting scattered light from the circuit pattern in the periphery of the end of the wafer 10 irradiated with the illumination light, an inspection unit 80 for inspecting the periphery of the end of the wafer 10 based on the scattered light from the circuit pattern detected by using the imaging unit 40, and a control unit 60 for performing various controls. The control unit 60 selects from a plurality of directions in which irradiation is possible, an irradiation direction of the illumination light with which the circuit pattern is irradiated by the illumination unit 30 at the inspection time. |
