发明名称 METHOD FOR PRODUCING ADHESIVE FILM, AND FLEXIBLE METAL-CLAD LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide an adhesive film and improve moisture-absorption soldering resistance of a flexible metal-clad laminate produced by using the adhesive film.SOLUTION: The adhesive film has an adhesive layer containing a thermoplastic polyimide on at least one surface of a heat-resistant polyimide film, wherein the thermoplastic polyimide has a specific composition composed mainly of pyromellitic acid dianhydride and 2,2-bis-[4-(4-aminophenoxy)phenyl]propane and is produced by imidizing a polyimide precursor at 320-400°C.
申请公布号 JP2011195771(A) 申请公布日期 2011.10.06
申请号 JP20100066614 申请日期 2010.03.23
申请人 KANEKA CORP 发明人 KONDO YASUTAKA;KANESHIRO NAGAYASU;MATSUTANI AKIO;FUJIMOTO SHOGO
分类号 C09J7/02;B32B15/08;B32B27/34;C08G73/10;C09J179/08;H05K1/03 主分类号 C09J7/02
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