发明名称 |
METHOD FOR PRODUCING ADHESIVE FILM, AND FLEXIBLE METAL-CLAD LAMINATE |
摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film and improve moisture-absorption soldering resistance of a flexible metal-clad laminate produced by using the adhesive film.SOLUTION: The adhesive film has an adhesive layer containing a thermoplastic polyimide on at least one surface of a heat-resistant polyimide film, wherein the thermoplastic polyimide has a specific composition composed mainly of pyromellitic acid dianhydride and 2,2-bis-[4-(4-aminophenoxy)phenyl]propane and is produced by imidizing a polyimide precursor at 320-400°C. |
申请公布号 |
JP2011195771(A) |
申请公布日期 |
2011.10.06 |
申请号 |
JP20100066614 |
申请日期 |
2010.03.23 |
申请人 |
KANEKA CORP |
发明人 |
KONDO YASUTAKA;KANESHIRO NAGAYASU;MATSUTANI AKIO;FUJIMOTO SHOGO |
分类号 |
C09J7/02;B32B15/08;B32B27/34;C08G73/10;C09J179/08;H05K1/03 |
主分类号 |
C09J7/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|