发明名称 |
Semiconductor Device Packages with Fan-Out and with Connecting Elements for Stacking and Manufacturing Methods Thereof |
摘要 |
An embodiment of a semiconductor device package includes: (1) an interconnection unit including a patterned conductive layer; (2) an electrical interconnect extending substantially vertically from the conductive layer; (3) a semiconductor device adjacent to the interconnection unit and electrically connected to the conductive layer; (4) a package body: (a) substantially covering an upper surface of the interconnection unit and the device; and (b) defining an opening adjacent to an upper surface of the package body and exposing an upper surface of the interconnect; and (5) a connecting element electrically connected to the device, substantially filling the opening, and being exposed at an external periphery of the device package. The upper surface of the interconnect defines a first plane above a second plane defined by at least a portion of the upper surface of the interconnection unit, and below a third plane defined by the upper surface of the package body.
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申请公布号 |
US2011241193(A1) |
申请公布日期 |
2011.10.06 |
申请号 |
US20100753840 |
申请日期 |
2010.04.02 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
DING YI-CHUAN;CHEN CHIA-CHING |
分类号 |
H01L23/538;H01L21/50 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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