INTER -DIE INTERCONNECTION INTERFACE

摘要

A die is provided for use in a package comprising said die and at least one further die. The die comprises an interface configured to receive a transaction from the further die via an interconnect and for transmitting a response to the further die via the interconnect. The die also has mapping circuitry configured to allocate to the received transaction a local source identity information as source identity information, the local source identity information comprising one of a set of reusable local source identity information. The arrangement ensures the order of transactions tagged with a same original source identity and target and allows transactions tagged with different source identifiers to be processed out of order.