SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THEREOF,申请号KR20100026298-传众专利搜索

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发明名称	SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THEREOF
摘要
申请公布号	KR20110107116(A)	申请公布日期	2011.09.30
申请号	KR20100026298	申请日期	2010.03.24
申请人	HYNIX SEMICONDUCTOR INC.	发明人	JEONG, JUNG TAE;PARK, KYOUNG SOOK;KIM, KI BUM
分类号	H01L23/12;H01L23/28;H01L23/48	主分类号	H01L23/12
代理机构		代理人
主权项
地址

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