PLATING SOLUTION FOR ELECTROLESS DEPOSITION OF COPPER

摘要

AN ELECTROLESS COPPER PLATING SOLUTION IS DISCLOSED HEREIN. THE SOLUTION INCLUDES AN AQUEOUS COPPER SALT COMPONENT, AN AQUEOUS COBALT SALT COMPONENT, A TRIAMINE BASED COMPLEXING AGENT, AND AN ACIDIC PH-MODIFYING SUBSTANCE IN AN AMOUNT SUFFICIENT TO MAKE THE ELECTROLESS COPPER PLATING SOLUTION ACIDIC. A METHOD OF PREPARING AN ELECTROLESS TO COPPER SOLUTION IS ALSO PROVIDED.