摘要 |
<p>Disclosed is a composition for forming a plating layer intended to be capable of forming a polymer layer with excellent insulation reliability, which realizes high adhesiveness with a plating film (metal film) formed on the surface of the same. The composition for forming a plating layer comprises a polymer that contains a radical polymerizable group, a non-dissociative functional group for creating mutual action with a plating catalyst or a precursor of the same, and at least one functional group selected from the following: an epoxy group, an oxetanyl group, an isocyanate group, a blocked isocyanate group, a primary amino group and a secondary amino group.</p> |