发明名称 |
STRESS RESISTANT MICRO-VIA STRUCTURE FOR FLEXIBLE CIRCUITS |
摘要 |
<p>A chip package is disclosed that includes an electronic chip having a plurality of die pads formed on a top surface thereof, with a polyimide flex layer positioned thereon by way of an adhesive layer. A plurality of vias is formed through the polyimide flex layer and the adhesive layer corresponding to the die pads. A plurality of metal interconnects are formed on the polyimide flex layer each having a cover pad covering a portion of a top surface of the polyimide flex layer, a sidewall extending down from the cover pad and through the via along a perimeter thereof, and a base connected to the sidewall and forming an electrical connection with a respective die pad. Each of the base and the sidewall is formed to have a thickness that is equal to or greater than a thickness of the adhesive layer.Figure 4</p> |
申请公布号 |
SG173975(A1) |
申请公布日期 |
2011.09.29 |
申请号 |
SG20110012119 |
申请日期 |
2011.02.21 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
GORCZYCA, THOMAS, BERT;SAIA, RICHARD, JOSEPH;MCCONNELEE, PAUL, ALAN |
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