| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance heat dissipation performance of an imaging device. <P>SOLUTION: This imaging device 100 is equipped with: a housing 101 including an opening region 102 and formed of a first material; an illuminating first board 114 arranged to close the opening region 102 in the housing 101; an imaging second board 133 arranged in parallel to the first board 114 in the housing 101; and heat dissipation members 151, 152, 153 each formed of a second material having a high heat-transfer coefficient relative to that of the first material, and mounted to side faces of the housing 101 to surround the opening region 102 of the housing 101. Recessed parts 101A, 101B, 101C are formed on the side faces of the housing 101. The heat dissipation members include projecting parts 151A, 152A, 153A fitting to the recessed parts. <P>COPYRIGHT: (C)2011,JPO&INPIT |
