| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device suitable for preventing the peeling of a film accompanying dicing and preventing abnormal discharge. <P>SOLUTION: A semiconductor device is formed of a scribe region 003 and an IC region 004. At least one isolation groove 007 is provided on an interlayer insulating film 002 of the scribe region 003. A sidewall 011 formed of a plug metal film is formed on side walls of both sides of the isolation groove 007. A passivation film covering at least the side walls is provided. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
| 申请公布号 |
JP2011192846(A) |
申请公布日期 |
2011.09.29 |
| 申请号 |
JP20100058449 |
申请日期 |
2010.03.15 |
| 申请人 |
SEIKO INSTRUMENTS INC |
发明人 |
RISAKI TOMOMITSU;NAKANISHI AKISHIGE;SHIMAZAKI KOICHI |
| 分类号 |
H01L21/301;H01L21/3205;H01L21/768;H01L21/822;H01L23/52;H01L27/04 |
主分类号 |
H01L21/301 |
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