发明名称 METHOD FOR MANUFACTURING NON-CONTACT IC CARD
摘要 <p><P>PROBLEM TO BE SOLVED: To secure thickness precision of a product in the neighborhood of the end of a sheet laminate by preventing the outflow of a part of adhesive from the end of a sheet laminate in case of holding an antenna sheet on which a non-contact IC member is loaded between front and back base material sheets, and pressing it by a smoothing press machine. <P>SOLUTION: The method for manufacturing the non-contact IC card includes: successively laminating a front base material sheet, adhesive, an antenna sheet on which the non-contact IC card member is loaded, adhesive, and a back base material sheet; and holding and pressurizing print surfaces exposed from the front base material sheet and the back base material sheet between smoothing metal plates 54, so that the sheet laminate 15 of the non-contact IC card is laminated, wherein the opposite faces of the front base material sheet and back base material sheet faces of the metal plates 54 holding the sheet laminate 15 in-between, have a frame 55 with a closed shape including the product area of the sheet laminate. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011191840(A) 申请公布日期 2011.09.29
申请号 JP20100055370 申请日期 2010.03.12
申请人 DAINIPPON PRINTING CO LTD 发明人 TATSU JINTARO
分类号 G06K19/077;B42D15/10;G06K19/07 主分类号 G06K19/077
代理机构 代理人
主权项
地址