METHOD FOR MOUNTING ELECTRONIC COMPONENTS, AND ELECTRONIC DEVICE

摘要

Provided is a method for mounting electronic components in a resin sealing process for a mounting board on which a plurality of electronic components are mounted. According to the method for mounting electronic components, the electronic components can be reliably mounted on the mounting board without the occurrence of voids and filling defects and the size of the mounting board can be reduced. The method for mounting electronic components includes a step in which electronic components (30) arranged between injection sections for a resin (40) are joined to a wiring board (10) by using a joining material (50).