| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive for bonding a semiconductor chip with which a semiconductor device with superior reflow cracking resistance and high reliability is manufactured, and to provide nonconductive paste and a non-conductive film which are formed using the adhesive for bonding the semiconductor chip. SOLUTION: The adhesive for bonding the semiconductor chip contains an epoxy compound and an imidazole compound. The epoxy compound contains at least one kind selected from a group comprising an anthracene derivative having an epoxy group and a naphthalene derivative having an epoxy group, and the content of the imidazole compound is 0.3 to 4 parts by weight for 100 parts by weight of the epoxy compound. COPYRIGHT: (C)2011,JPO&INPIT |
