| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermosetting adhesive composition which shows a superior solder cracking resistance when subjected to a high temperature solder reflow process at a temperature of about 260°C that is carried out for lead-free soldering, and also to provide a semiconductor package using the thermosetting adhesive composition. <P>SOLUTION: A manufacturing method for a semiconductor device has steps of: bonding a resin support made by impregnating a fibrous support base material with a thermosetting resin to a semiconductor element by using a thermosetting adhesive composition under a given heating condition A; sealing the support and semiconductor element bonded together in the previous step by using a sealing resin composition under a given heating condition B; and subjecting the sealed support and semiconductor element to heat treatment. The amount of warpage 1 of the thermosetting adhesive composition determined by a given warpage evaluation test satisfies a given conditional expression. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
