发明名称 BONDING MATERIAL AND BONDING METHOD USING SAME
摘要 Disclosed is a method for forming a bonded body using metal nanoparticles. Specifically disclosed is a paste which contains a flux component that can form a metal phase even in an inert atmosphere. A bonding material, which is capable of achieving practical bonding strength in an inert atmosphere including a nitrogen atmosphere at low temperatures without requiring the application of a pressure that has been necessary for conventional bonding materials, can be obtained using the above-described paste. The paste is configured of silver nanoparticles that have an average primary particle diameter of 1-200 nm and are covered with an organic material having 8 or less carbon atoms, a flux component that has at least two carboxyl groups, and a dispersion medium. By using the paste as a bonding material, bonding between materials becomes possible even at temperatures not higher than 300°C.
申请公布号 WO2011114543(A1) 申请公布日期 2011.09.22
申请号 WO2010JP57293 申请日期 2010.04.23
申请人 DOWA ELECTRONICS MATERIALS CO., LTD.;ENDOH, KEIICHI;HISAEDA, YUTAKA;MIYAZAWA, AKIHIRO;NAGAHARA, AIKO;UEYAMA, TOSHIHIKO 发明人 ENDOH, KEIICHI;HISAEDA, YUTAKA;MIYAZAWA, AKIHIRO;NAGAHARA, AIKO;UEYAMA, TOSHIHIKO
分类号 B22F9/00;B22F1/00;B22F1/02;H01L21/52;H05K3/32 主分类号 B22F9/00
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