摘要 |
Disclosed is a method for forming a bonded body using metal nanoparticles. Specifically disclosed is a paste which contains a flux component that can form a metal phase even in an inert atmosphere. A bonding material, which is capable of achieving practical bonding strength in an inert atmosphere including a nitrogen atmosphere at low temperatures without requiring the application of a pressure that has been necessary for conventional bonding materials, can be obtained using the above-described paste. The paste is configured of silver nanoparticles that have an average primary particle diameter of 1-200 nm and are covered with an organic material having 8 or less carbon atoms, a flux component that has at least two carboxyl groups, and a dispersion medium. By using the paste as a bonding material, bonding between materials becomes possible even at temperatures not higher than 300°C. |
申请人 |
DOWA ELECTRONICS MATERIALS CO., LTD.;ENDOH, KEIICHI;HISAEDA, YUTAKA;MIYAZAWA, AKIHIRO;NAGAHARA, AIKO;UEYAMA, TOSHIHIKO |
发明人 |
ENDOH, KEIICHI;HISAEDA, YUTAKA;MIYAZAWA, AKIHIRO;NAGAHARA, AIKO;UEYAMA, TOSHIHIKO |