| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulation coating by which an insulation film of a uniform thickness can be formed over an entire circumference of a flat conductor and an insulation film with good workability and productivity can be provided, and to provide an insulated wire with the coating applied and baked. SOLUTION: The polyamideimide resin insulation coating is obtained by dissolving polyamideimide resin obtained by synthesizing and reacting an isocyanate component mainly containing 4, 4'-diphenylmethane diisocyanate, and an acid component mainly containing trimellitic anhydride in a solvent component mainly containing cyclic ketones having a boiling point in a range of 130-180°C. The solvent component of 70-100 mass% is the cyclic ketones, and a ratio (a+b)/(A+B) of a compounding amount of the 4,4'-diphenylmethane diisocyanate (a) and the trimellitic anhydride (b) with respect to a compounding amount of the isocyanate component (A) and the acid component (B) is 85-100 mol% by mole ratio. COPYRIGHT: (C)2011,JPO&INPIT
|
