发明名称 Bonded Circuits and Seals in a Printing Device
摘要 A fluid ejection device includes a circuit layer having a fluid outlet on a lower surface, a chamber substrate having a fluid inlet on an upper surface, an electrical contact electrically connecting the chamber substrate to the lower surface of the circuit layer, and a seal forming a fluid connection between the fluid outlet of the circuit layer and the fluid inlet of the chamber substrate. The seal and the electrical contact are a eutectic material. The seal and the electrical contact may be the same material.
申请公布号 US2011226807(A1) 申请公布日期 2011.09.22
申请号 US20100728020 申请日期 2010.03.19
申请人 ESSEN KEVIN VON;HIGGINSON JOHN A;BIBL ANDREAS 发明人 ESSEN KEVIN VON;HIGGINSON JOHN A.;BIBL ANDREAS
分类号 B67D7/08;B23P17/00 主分类号 B67D7/08
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