| 摘要 |
PROBLEM TO BE SOLVED: To reduce an area occupied by communication signal lines and a constitution related to the communication signal lines on a printed wiring board without influencing communication performance. SOLUTION: Wiring patterns La1 to La4 used for first communication and wiring patterns Lb1 to Lb4 used for second communication are laid out on the printed wiring board 1 alternately in parallel. Guard patterns Lg1 and Lg2 fixed at ground potential are laid out in parallel with the wiring patterns La1 and Lb1, respectively. When performing the first communication with a memory 3, an MCU 2 applies 0-V potential to terminals PB1 to PB4 to fix the potential of the wiring patterns Lb1 to Lb4 at the ground potential. Furthermore, when performing the second communication with a memory 4, the MCU 2 applies 0-V potential to the terminals PA1 to PB4 to fix the potential of the wiring patterns La1 to La4 at the ground potential. COPYRIGHT: (C)2011,JPO&INPIT
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