SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device easy to manufacture, substituting for a BGA(ball grid array) type of semiconductor device. SOLUTION: A plurality of leads 10 and stages 20 where semiconductor chips 60 are mounted are arranged side by side at specified intervals. At the specified section of the bottom of the lead is a projected terminal 12. The electrode of a semiconductor chip 60 and a terminal 14 on the top of the lead are connected electrically with each other by wire. The topsides and side faces of the plural leads 10 and the topside and side face of the stage 20 are covered in layer form continuously with an insulating material 30. Then, the plural leads 20 and the stage 20 are coupled in series through the insulating material 30. Together with it, a semiconductor chip 60 is enclosed inside the insulating material 30, and the terminal 12 at the bottom of the lead is exposed between the insulators 30.