发明名称 |
Plating bath and method |
摘要 |
Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.
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申请公布号 |
US2011220514(A1) |
申请公布日期 |
2011.09.15 |
申请号 |
US20100661312 |
申请日期 |
2010.03.15 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS LLC |
发明人 |
NIAZIMBETOVA ZUKHRA I. |
分类号 |
C25D3/38;C07D207/04;C07D233/02;C07D233/58;C07D235/06;C07D303/30;C07D493/04;C25D7/00 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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