| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming wiring conductors by which fine wiring conductors are formed with high density by suppressing the occurrence of a problem in which the wiring conductor is considerably thinned and a bottom surface of the wiring conductor, which comes in contact with an insulating layer, is hollowd deeply from both sides. SOLUTION: In an etching process of forming the wiring conductor comprising an electrolytic copper plating layer 4 and an electroless copper plating layer 2 therebelow by etching the electroless copper plating layer 2 and electrolytic copper plating layer 4 using an etchant until the electroless copper plating layer 2 between wiring conductors 5 dissipates, etching processing is carried out using a first etchant which attains an etching speed for the electroless copper plating layer 2 being≤1.6 times an etching speed for the electrolytic copper plating layer 4, and then etching processing is carried out using a second etchant which attains an etching speed for the electroless copper plating layer 2 being≥2.4 times an etching speed for the electrolytic copper plating layer 4. COPYRIGHT: (C)2011,JPO&INPIT
|
