| 摘要 |
<p>AN EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTORS WHICH COMPRISES AS ESSENTIAL COMPONENTS (A) AN EPOXY RESIN, (B) A PHENOL RESIN, (C) A CURING ACCELERATOR, (D) AN INORGANIC FILLER AND (E) A COMPONENT COMPRISING (E1) A BUTADIENE-ACRYLONITRILE COPOLYMER HAVING CARBOXYL GROUP AND/OR (E2) A REACTION PRODUCT OF (E1) A BUTADIENE-ACRYLONITRILE COPOLYMER HAVING CARBOXYL GROUP WITH AN EPOXY RESIN, WHEREIN THE CONTENT OF COMPONENT (E1) IN THE ENTIRE EPOXY RESIN COMPOSITION IS 0.01 TO 1% BY WEIGHT. THE COMPOSITION EXHIBITS EXCELLENT RELEASING PROPERTY IN MOLDING, CONTINUOUS MOLDING PROPERTY AND RESISTANCE TO SOLDER REFLOW.</p> |
