METHOD FOR PRODUCING LAMPS

摘要

The method involves providing a carrier as a heat sink including a laminar chip assembly region. The assembly region is structured by applying a solder layer on the assembly region for producing partial regions (12a, 17) that are solder-resistant after the structuring. A solder is applied on the assembly region such that the assembly region wets one of the partial regions. A luminous body (100) i.e. LED, is applied with the solder in the partial region. An electrical contact is formed for supplying electrical energy to the luminous body.