发明名称 BASE MATERIAL FOR WIRING CIRCUIT SUBSTRATE, METHOD OF MANUFACTURING THE BASE MATERIAL FOR WIRING CIRCUIT SUBSTRATE, WIRING CIRCUIT SUBSTRATE, AND METHOD OF MANUFACTURING THE WIRING CIRCUIT SUBSTRATE, SUSPENSION SUBSTRATE FOR HDD, SUSPENSION FOR HDD, AND HARD DISK DRIVE
摘要 <P>PROBLEM TO BE SOLVED: To form a fine resist pattern consisting of a photosensitive material layer by preventing spread of exposure light caused by scattered light from a surface of a conductor layer, and as a result, to obtain a desired fine wiring interval. <P>SOLUTION: A base material for wiring circuit substrate has: a first insulating layer 21 consisting of an insulating material; and a conductor layer 10 provided on the first insulating layer 21. A surface roughness Ra of the conductor layer 10 on the opposite non-contacting surface side of the first insulating layer 21 is 0.1 &mu;m or less. A fine convexoconcave shape 10a is formed on the surface on the non-contacting surface side of the conductor layer 10, and a surface area per unit area of the surface is 1.1 or more and 1.4 or less. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011176051(A) 申请公布日期 2011.09.08
申请号 JP20100037864 申请日期 2010.02.23
申请人 DAINIPPON PRINTING CO LTD 发明人 SUZUKI KATSUTOSHI;YAMAKAWA KEIJIRO;FURUSE AYAKO;MAEDA TAKANORI
分类号 H05K1/09;G11B5/60;G11B21/21;H05K1/02;H05K3/28 主分类号 H05K1/09
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