| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plane type semiconductor fingerprint detection device which does not require a specific module and a conventional sealing method. <P>SOLUTION: In the plane type semiconductor fingerprint detection device, a plurality of fingerprint detection elements are mounted to a silicon substrate to read out a fingerprint of a finger put on the fingerprint detection elements and generate a plurality of electric signals. A laminated circuit is formed on the substrate to process the electric signals. A plurality of first bonding pads are located on the substrate and electrically connected to an integrated circuit. A first insulating layer is located under the first bonding pads. A plurality of through electrodes penetrate the substrate and are electrically connected to the first bonding pads. A second insulating layer is formed on the substrate and between the through electrodes and the substrate. A plurality of second bonding pads are formed on the back of the second insulating layer and electrically connected to the first bonding pads through the electrodes, respectively. A protection layer is located on the substrate, covers the fingerprint detection elements to form a flat external surface to be in contact with a finger. <P>COPYRIGHT: (C)2011,JPO&INPIT |
