SEMICONDUCTOR PACKAGE FOR MEMS DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor package and a method for manufacturing the same are provided. The semiconductor package includes: a base (130) having a cavity; an interposer (120) coupled to the base (130) and at least partially over the cavity such that the interposer (120) and the base (130) form a back chamber (108), and a first opening (142) into the back chamber formed in the interposer (120); a micro-electro-mechanical system device (105) located over the interposer (120) at the first opening (142); and a lid (110) coupled to the base (130).